RFID manufacturing concepts

ABSTRACT

Radio frequency identification labels are made in a high speed and effective manner in a variety of different ways utilizing a number of different sources of RFID inlets, each inlet including an antenna and a chip. A plurality of webs are matched together and RFID labels are die cut from the webs, to produce lined RFID labels. Alternatively linerless RFID labels are produced from a composite web with a release material on one face and pressure sensitive adhesive on the other, the labels formed by perforations in the web.

BACKGROUND AND SUMMARY OF THE INVENTION

[0001] RFID (radio frequency identification) labels are becoming morewidely used for a wide variety of purposes, such as shown in U.S. Pat.Nos. 5,206,626, 5,448,110, and 5,497,140. The more inexpensively andquickly the RFID labels can be made, the even more widespread theirappeal will be because they will be able to be cost effectivelyincorporated into numerous products and environments.

[0002] According to the present invention a method of making RFID labelsis provided which has optimum versatility, and can effectively produce awide variety of different types of RFID labels (including lined orlinerless labels) in a cost effective manner. The RFID labels may bemade according to the present invention at high speed, typically atspeeds of at least about 100 feet per minute, utilizing conventional webhandling equipment.

[0003] According to one aspect of the present invention a method ofmaking RFID labels is provided comprising: (a) Providing a plurality ofRFID inlets, each including a chip (and antenna), on a first web. (b)Covering the RFID inlets with a second web to provide a composite web.(c) Providing pressure sensitive adhesive on a portion of one of thewebs that will be an exterior portion of a label once ultimately formed.(d) At least one of verifying the functionality of, or programming, thechips prior to formation of the composite web. And, (e) acting on thecomposite web so as to provide the composite web into labels having atop face, and a bottom face with pressure sensitive adhesive. The methodmay further comprise (f) imaging variable indicia on the top face. Highspeed practice of the method is possible; that is (a)-(e) may bepracticed at a rate of at least about 100 feet per minute (e.g. up toabout 300 ft./min.). Also typically (f) is practiced after (e).

[0004] The method is very versatile, and a wide variety of differentmaterials and procedures may be utilized in the practice of theinvention. For example (a) may be practiced using a paper web as thefirst web, and (b) may be practiced using transfer tape, or a linerwhich is coated with pressure sensitive adhesive prior to engagementbetween the webs, as the second web. Alternatively (a) may be practicedusing RFID film, in which case typically (b) is practiced by separatingthe face stock and liner of a label laminate, and using one of the facestock or liner as the second web and the other as a third web; andfurther comprising, after (b), (g) laminating the third web onto thesecond web by passing the webs between laminating rolls to sandwich thechips between the second and third webs. The method may also furthercomprise (h) forming openings or recesses in the third web aligned withthe inlets, in which case (g) is further practiced by ensuring that theinlets enter the openings or recesses in the third web. That is (g) maybe practiced by die cutting openings in the third web, or by calenderingrecesses in the third web.

[0005] The method may also further comprise sensing the RFID chips ofthe inlets prior to formation of the composite web so as to establish aregistration signal for what will become each label. Also (b) may bepracticed by laminating the first and second webs by passing thembetween laminating rolls without harming the inlets. Further (b) may bepracticed by laminating the first and second webs by passing thembetween laminating rolls without harming the webs, such as by providinga recess in at least one of (and perhaps both of) the laminating rollsin alignment with the inlets, or by providing a deformable covering onat least one (preferably both) of the laminating rolls so that thedeformable covering deforms when contacting the inlets. Also, (b) may bepracticed by cutting the first web to provide separate sheets eachhaving an inlet, and placing the sheets onto the second web, and byplacing the sheets onto adhesive on the second web.

[0006] In the method (e) may be practiced by die cutting the labels fromone of the webs to provide a plurality of labels and matrix material ona liner, and removing the matrix material from the labels on the liner.Also they may further comprise making a final RFID chip readverification after (e). The method may further comprise applying acoating of adhesive release material to one of the webs, opposite thepressure sensitive adhesive; and wherein (e) is practiced by perforatingthe composite web to form a plurality of linerless labels.

[0007] According to another aspect of the present invention a method ofmaking RFID labels is provided comprising: (a) Providing a plurality ofRFID inlets, each including a chip, on a first web. (b) Covering theRFID inlets with a second web. (c) Laminating a third web onto thesecond web by passing the webs between laminating rolls to sandwich theinlets between the second and third webs without harming the inlets, toprovide a composite web. (d) Providing pressure sensitive adhesive on aportion of one of the webs that will be an exterior portion of a labelonce ultimately formed. And, (e) acting on the composite web so as toprovide the composite web into labels having a top face, and a bottomface with pressure sensitive adhesive. The details of the procedure setforth above may be as described above. Also the method may furthercomprise applying heat expandable microspheres on the chips, and heatingthe microspheres to expand the microspheres to produce a cushion.

[0008] According to yet another aspect of the present invention there isprovided a method of making RFID labels, comprising: (a) Providing aplurality of RFID inlets, each having a chip and antenna, on a compositeweb. (b) Providing pressure sensitive adhesive on a portion of one ofthe composite web that will be an exterior portion of a label onceultimately formed. (c) At least one of verifying the functionality of,or programming, the chips prior to formation of the composite web. (d)Sensing the RFID chips prior to formation of the composite web so as toestablish a registration signal for what will become each label. (e)Acting on the composite web so as to provide the composite web intolabels having a top face, and a bottom face with pressure sensitiveadhesive. (f) Imaging variable indicia on the top face. And, (g) after(e) making a final RFID chip read verification.

[0009] The invention also comprises RFID labels made by any of themethod procedures as described above.

[0010] It is the primary object of the present invention to quickly,easily, and cost effectively product RFID labels, for a wide variety ofuses. This and other objects of the invention will become clear from aninspection of the detailed description of the invention and from theappended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011]FIG. 1 is a schematic view of exemplary apparatus for practicingone embodiment of the method according to the present invention;

[0012]FIG. 2 is a schematic end view of a laminating roller that may beutilized in the practice of the method of FIG. 1;

[0013]FIG. 3 is a perspective schematic view showing the final RFIDlabels produced practicing the method of FIG. 1, with one of the labelsbeing shown as being peeled away from the substrate;

[0014]FIG. 4 is a view like that of FIG. 1 only showing a secondembodiment of a method according to the present invention;

[0015]FIG. 5 is a schematic perspective view showing the face stock ofthe material of FIG. 4 after it has been die cut or calendered toprovide chip-receiving openings or recesses therein;

[0016]FIG. 6 is a view like that of FIG. 2 only showing a differentconfiguration of laminating rolls that may be utilizable for practicingthe method of FIGS. 1 and 4;

[0017]FIGS. 7 through 11 are views like that of FIG. 1 only showingdifferent embodiments of exemplary methods according to the presentinvention;

[0018]FIG. 12 is a schematic side view showing an exemplary linerlesslabel web that is made pursuant to the method of FIG. 11; and

[0019]FIGS. 13 and 14 are views like that of FIG. 12 only showingalternative embodiments for making linerless RFID label webs such asillustrated in FIG. 12.

DETAILED DESCRIPTION OF THE DRAWINGS

[0020] Each of the embodiments of FIGS. 1, 4, 7 through 11, 13 and 14illustrate different configurations of equipment, and different startingmaterials. The embodiments of FIGS. 1, 4, and 7 through 10 make linedRFID labels, such as shown in FIG. 3, while the embodiments of FIGS. 11,13 and 14 make linerless RFID labels, such as shown in FIG. 12. Thedifferences in starting materials between the various embodiments areclear from the following Table I. TABLE I Main Web Embodiment Unwind TagSupply Unwind Cover Web Unwind RFID Inlets on Paper Jackfree TransferTape or Liner with Adhesive Coating Label Die Cut RFID Film LabelLaminate Liner Laminate Labels (Bottom) Label RFID Film Inlet Roll LabelLaminate Liner Laminate (Bottom) Label RFID Film Inlet Roll LabelLaminate Liner Laminate (Top) Paper RFID Film Inlet Jackfree TransferTape Linerless or Laminate or Liner with Adhesive Coating Label RFIDFilm Inlet Label Laminate Liner Laminate Linerless or Laminate (Top)Paper Die Cut RFID Film None (Linerless) Labels Paper RFID Film InletNone (Linerless) Linerless or Laminate Paper REID Film Inlet Roll None(Linerless)

[0021] In the method of FIG. 1, a roll 11 of paper 12 having RFIDconventional inlets 15 thereon is provided as a first web. As seen inFIG. 3, each conventional inlet 15 comprises a conventional chip 15A anda conventional antenna 15B. The paper 12 has a bottom face 13 and a topface 14, the face 14 becoming the outward face of the labelssubsequently produced.

[0022] The paper web 12 moves past a station 16 where conventional RFIDread/writer equipment is provided. The equipment 16 practices at leastone of verifying the functionality of, or programming, the chips 15A ofinlets 15 prior to the formation of a composite web. Also preferably aconventional scanner 17 is utilized which may be an optical sensor or aproximity sensor, to sense the RFID inlets 15 prior to formation of acomposite web so as to establish a registration signal for what willbecome each ultimate label.

[0023] If desired the optional equipment 18 for print expandablemicrospheres onto the chips 15A may be provided, such as shown inco-pending U.S. application Ser. No. 09/393,291 filed Sep. 10, 1999(atty. docket 263-2076), the disclosure of which is hereby incorporatedby reference herein. After the microspheres are applied they are heatedby a conventional heater 19 which expands them so as to form a cushionfor the chip 15A to protect it during subsequent production handling,and when it is being used.

[0024] Ultimately the web 12 passes to a lamination stage 20 where apair of laminating rollers 21, 22 are provided through which the paperweb 12, and a second web (either 32 or 38) are passed to produce alamination at 20. The lamination must be effected without damaging thechips 15A. One way that this may be accomplished is by utilizing theparticular rollers illustrated in FIG. 2.

[0025] In FIG. 2 the laminating rollers 21, 22 are shown schematically,rotatable about substantially parallel axes 23, 24, respectively, withthe webs passing therebetween. The first roller 21 has a main bodyportion 25 while the second roller 22 is a main body portion 26, theportions 25, 26 cooperating together to apply pressure so as to laminatethe web 12 to another web (32 or 38). In order to accommodate the inlets15, a recess 27 is provided in the roller 21, aligned with the inlets15. As shown in FIG. 2 only the roll 21 is recessed, but if desired theroll 22 also can be recessed. Further, while the recess 27 illustratedin FIG. 1 is shown as continuous, where there is a proper control oftiming between the various elements the recess 27 may be a plurality ofinterrupted recesses around the periphery of the roll 21, being providedonly where inlets 15 will appear on the paper web 12.

[0026] The second web which is provided at the laminating station 20 maytake the form of a roll 29 of transfer tape, with the first liner 30removed therefrom and taken up on the liner rewind 31, while the secondliner 32, with adhesive, passes into operative association with thelamination stage 20, with the adhesive from the second web 32, broughtinto contact with the face 13 of the paper web 12.

[0027] Alternatively, as illustrated in dotted line in FIG. 1, a roll 33of simple liner material 34 may be provided which passes around a roll35 and to which a hot melt pressure sensitive adhesive (or a likepressure sensitive adhesive) is applied utilizing the conventionalapplicator 36. The now adhesive-coated web passes around the releasesurface coated roll 37, the web 38 then being (after the roll 35)substantially the same as the web 32, and being laminated in the sameway as indicated at stage 20.

[0028] The composite web 40 that is produced from the lamination stage20 is then acted upon so as to make the composite web 40 into labels.For example as illustrated schematically at 41 in FIG. 1, conventionaldie cutting equipment 41 is utilized to die cut the composite web 40into labels. Typically after die cutting at 41 a final RFID readverification stage 42 is provided, utilizing conventional equipment, andthe web 40 passes through the rolls 43 at which variable indicia whichis preferably imprinted on the RFID labels. The printing that takesplace at 43 may be utilizing any conventional variable informationprinting technology, such as ink jet technology.

[0029] The final web 45 produced is either zigzag folded, or—asillustrated schematically in FIG. 1—taken up on a roll 45. The matrixmaterial from the die cut stage 41 is removed as illustrated at 46 inFIG. 1, and typically taken up on a matrix rewind 47.

[0030] The RFID labels 48 according to the invention, on the label web44 with matrix material removed, are illustrated schematically in FIG.3. The top surface 12, 14 of each label 48 has indicia 50 (preferablyvariable indicia imaged at 43, and also possibly earlier imagednon-variable indicia) thereon. The back face of the labels 48 havepressure sensitive adhesive 49, from the liner with adhesive 32 orapplied by the adhesive applicator 36, thereon which is readily releasedfrom the liner material 32, 38. Each inlet 15 is covered by the paperforming the web 12, which paper is cut away for the middle label 48 seenin FIG. 3 so as to illustrate the chip 15.

[0031]FIG. 4 illustrates another embodiment according to the presentinvention. Components in FIG. 4 comparable to those in FIG. 1 are shownby the same reference numeral only preceded by a “1”, and thedescription thereof will not be repeated.

[0032] In the FIG. 4 embodiment the first web is in the form of RFIDfilm labels from a roll 52, being shown at 53 with the inlets 15 thereon(previously produced RFID inlets 15 are provided die cut on a filmcarrier with pressure sensitive adhesive holding the inlet 15 to arelease coated liner web). The first web 53 passes past a conventionalpeel station where the inlets 15 on the labels 53, with adhesive, arepeeled from the liner web with the adhesive face thereof ultimatelycoming into contact with the second web, by passage around a placingroll 57.

[0033] As indicated in Table I above, in the FIG. 4 embodimentpreferably the main web unwind is a roll 59 of label laminate 60comprising a face stock 61 and a liner 62 which are separated from eachother as indicated in FIG. 4, with pressure sensitive adhesive 63staying on the face stock 61 as it moves in a path around the equipment52-57. As indicated schematically at 64 in FIG. 4 equipment acts on thethird web 61, a face stock in this case, to form openings or recessestherein aligned with the inlets 15, and into which the inlets 15 areultimately placed. After the inlets 15 in the form of labels spaced fromeach other are placed by the roller 57 onto the second web 62, they areultimately mated with the third web 61 at the laminating station 120.

[0034]FIG. 5 shows the third web 61 with an opening 65, or a calenderedrecess 66, formed therein. While both an opening 65 and recess 66 areillustrated in FIG. 5 typically the equipment 64 will only form openingsor recesses but not both in the same web 61. The opening 65 is formed bydie cutting while the recess 66 is formed by calendering. Theopenings/recesses 65, 66 are larger than an inlet 15, but smaller thanthe ultimate labels to be formed, shown in dotted line at 48 in FIG. 5.At the laminating stage 120 the inlets 15 enter the openings 65 orrecesses 66.

[0035]FIG. 6 shows a laminating stage 120 with a different type oflaminating rollers, yet which will still prevent the inlets 15 frombeing harmed, compared to the embodiment of FIG. 2. In the FIG. 6embodiment both rollers 121, 122 are shown having soft compressiblematerial covering 68 (such as urethane foam), over a hard material core69 or the like, which will deform sufficiently for the inlets 15 not tobe harmed, while yet still having enough rigidity so as to applypressure to provide a fully formed composite web 140.

[0036] In the FIG. 7 embodiment components comparable to those in theFIGS. 1 and 4 embodiments are shown by the same two digit referencenumeral only preceded by a “2” and similarly for all subsequentembodiment figures but those in FIG. 8 preceded by a “3”, those in 9 bya “4”, those in 10 by a “5”, those in 11 by a “6”, those in 13 by a “7”,and those in 14 by an “8”.

[0037] In the embodiment of FIG. 7 the primary difference between it andthe embodiment of FIG. 4 is the particular nature of the first web andassociated equipment. RFID inlets 15 are previously produced incontinuous form on a film carrier that is in a roll 72, the film carrierbeing shown at 73. A continuous adhesive coat may be provided on theface of the film carrier 73 opposite the inlets 15 by the conventionalequipment illustrated at 74 in FIG. 7, or a spot coat adhesive coatingmay be provided by the conventional equipment illustrated at 75 on thesecond web (liner) 262, the spot coats being provided particularly wherethe RFID inlet chips 15 will be provided. The continuous film web 73 iscut into separate sheets as indicated by the conventional cuttingequipment 76 in FIG. 7, and then the RFID inlet 15 sheets are placed bythe roll 257 onto the second web/liner 262, and ultimately laminatedwith the third web 261 at the laminating station 220.

[0038] In the FIG. 8 embodiment, the primary difference between thisembodiment and the FIG. 7 embodiment is that the face stock of the labellaminate 359 the face stock 361 comprises a second web while the liner362 comprises the first web. Also as indicated by the dotted line rollsnear the reference numerals 359 and 362 in FIG. 8, optionally theoriginal label laminate liner may be rewound and a new liner unwound inits place. Also in the FIG. 8 embodiment spot coat adhesive may beapplied as indicated at 80 instead at 374, 375. Also if the RFID inlet15 is small compared to the label size, no adhesive coating (that is nocoating equipment 374, 375, 80) at all is an option.

[0039] In the FIG. 9 embodiment, the second web is provided from a paperroll 81 and the first web unwound from roll 452 may be RFID film inletsthat are either linerless or if lined then the liner 82 can be rewoundon the winder 83. The second web 81 is die cut or recessed by theequipment 464 and the RFID film from the roller 452 is cut intoindividual sheets which are placed adhesive side down by the placingroll 257 after cutting by the equipment 476 onto the second web 81. Thethird web may be provided over the inlets 415 by either the transfertape web 432 or the adhesive coated liner web 438, with the webs 81, and432 or 438 with the RFID inlets 15 sandwiched therebetween passing tothe laminating station 420.

[0040] The FIG. 10 embodiment is similar to the FIG. 8 embodiment onlythe RFID film labels, in either linerless or lined form, such as shownin FIG. 9, are provided as the first web.

[0041] The FIG. 11 embodiment is one designed for producing linerlessRFID labels. In this embodiment the paper face stock 681 has a UVsilicone release coating (or other suitable adhesive release material)applied to a top face thereof as indicated at 85 in FIG. 11, the releasematerial then being cured by the conventional UV cure equipment 80. Theweb 81 is turned using conventional web turn bars 87 or the like, and aconventional continuous pressure sensitive adhesive application isprovided at station 88 to the opposite face that the silicone releasecoating was applied at 85. The equipment 664 then forms openings orcalendered recesses in the web 81.

[0042] The RFID film labels from roll 652 are applied from the first webso that the chips 15A themselves are placed by the placing roll 657 inthe openings or recesses (such as seen in FIG. 5) in the web 681.Ultimately the composite web formed by placing the RFID film labels fromsource 652 on the second web 681 are formed into individual labels byutilizing the conventional perforating equipment 89, to produce thelinerless label web 90 which can be wound up on the roll 91 illustratedin FIG. 11.

[0043] The web 90 is seen schematically in an enlarged side view in FIG.12. The adhesive release coating 93 is shown on top of the apertured orrecessed label body 92 (formed from web 681), with the pressuresensitive adhesive coat 95 provided by the equipment 88, and with theinlet 15 within (in this embodiment) cut out openings 94 formed in theweb base 92.

[0044] If desired an additional paper layer may be applied to form thelabel web 90, as illustrated in dotted line in FIGS. 11 and 12. Theadditional paper layer is taken up from the roll 96, openings orrecesses are formed therein using the equipment 664′, adhesive isapplied utilizing the equipment 88′, and the web 98 resulting therefrompasses through laminating rolls 620 as seen in FIG. 11 then, theadditional paper layer 98 is secured by the adhesive 95 to the firstpaper layer 92, with each inlet 15 also entering an opening 94′, andwith the pressure sensitive adhesive 99 at the bottom of the linerlesslabel web 90. The perforations introduced by the perforating equipment89, forming the web 90 into individual labels, are indicated by thedotted lines 100 in FIG. 12.

[0045] The FIG. 13 embodiment is like that of FIG. 11 only instead ofutilizing the RFID film labels 652 a RFID film inlets web, eitherlinerless or lined, 752 is provided, the film web being cut at 776before being placed by the roll 757.

[0046] The FIG. 14 embodiment is the same as the FIG. 13 embodiment onlythe RFID inlets are provided as the web 872 to which adhesive 874 isapplied before cutting at 876 and placing by the roll 857.

[0047] In all of the embodiments illustrated in FIGS. 1, 4, 7 through11, 13 and 14 because all conventional equipment, per se, is utilized,the systems for practicing the methods are easy to construct and costeffective, and operate in a simple yet effective manner. Also becauseweb handling is provided utilizing conventional web moving equipment,the methods may be practiced at high speed, for example at least about100 feet per minute web speed, even up to about 300 ft./min., making themethods even more cost effective.

[0048] While the invention has been herein shown and described in whatis presently conceived to be the most practical and preferredembodiments thereof it will be apparent to those of ordinary skill inthe art that many modifications may be made thereof within the scope ofthe invention, which scope is to be accorded the broadest interpretationof the appended claims so as to encompass all equivalent methods andproducts.

What is claimed is:
 1. A method of making RFID labels, comprising: (a)providing a plurality of RFID inlets, each including a chip, on a firstweb; (b) covering the RFID inlets with a second web to provide acomposite web; (c) providing pressure sensitive adhesive on a portion ofone of the webs that will be an exterior portion of a label onceultimately formed; (d) at least one of verifying the functionality of,or programming, the chips prior to formation of the composite web; and(e) acting on the composite web so as to provide the composite web intolabels having a top face, and a bottom face with pressure sensitiveadhesive.
 2. A method as recited in claim 1 further comprising (f)imaging variable indicia on the top face, and (a)-(e) are practiced at arate of at least about 100 ft./minute.
 3. A method as recited in claim 2wherein (f) is practiced after (e).
 4. A method as recited in claim 1further comprising sensing the RFID chips or inlets prior to formationof the composite web so as to establish a registration signal for whatwill become each label.
 5. A method as recited in claim 1 wherein (b) ispracticed by laminating the first and second webs by passing thembetween laminating rolls without harming the inlets.
 6. A method asrecited in claim 5 wherein (b) is practiced without harming the chips byproviding a recess in at least one of the laminating rolls in alignmentwith the inlets.
 7. A method as recited in claim 5 wherein (b) ispracticed by providing a deformable covering on at least one of thelaminating rolls so that the deformable covering deforms when contactingthe inlets.
 8. A method as recited in claim 1 wherein (b) is practicedby cutting the first web to provide separate sheets each having aninlet, and placing the sheets onto the second web.
 9. A method asrecited in claim 8 wherein (b) is further practiced by placing thesheets onto adhesive on the second web.
 10. A method as recited in claim8 wherein (b) is further practiced by laminating a third web onto thesecond web by passing the webs between laminating rolls to sandwich thechips between the secondhand third webs.
 11. A method as recited inclaim 10 wherein (b) is practiced without harming the inlets byproviding a recess in at least one of the laminating rolls in alignmentwith the inlets.
 12. A method as recited in claim 10 further comprising(f) forming openings or recesses in the third web aligned with theinlets, and wherein (b) is further practiced by insuring that the inletsenter the openings or recesses in the third web.
 13. A method as recitedin claim 12 wherein (f) is practiced by die cutting openings in thethird web.
 14. A method as recited in claim 12 wherein (f) is practicedby calendering recesses in the third web.
 15. A method as recited inclaim 1 further comprising (f) making a final RFID chip readverification after (e).
 16. A method as recited in claim 1 wherein (e)is practiced by die cutting the labels from one of the webs to provide aplurality of labels and matrix material on a liner, and removing thematrix material from the labels on the liner.
 17. A method as recited inclaim 1 further comprising applying a coating of adhesive releasematerial to one of the webs, opposite the pressure sensitive adhesive;and wherein (e) is practiced by perforating the composite web to form aplurality of linerless labels.
 18. A method as recited in claim 1wherein (a) is practiced using a paper web as the first web, and wherein(b) is practiced using transfer tape, or a liner which coated withpressure sensitive adhesive prior to engagement between the webs, as thesecond web.
 19. A method as recited in claim 1 wherein (a) is practicedusing RFID film.
 20. A method as recited in claim 19 wherein (b) ispracticed by separating the face stock and liner of a label laminate,and using one of the face stock or liner as the second web and the otheras a third web; and further comprising, after (b), (g) laminating athird web onto the second web by passing the webs between laminatingrolls to sandwich the chips between the second and third webs.
 21. Amethod as recited in claim 20 further comprising (g) forming openings orrecesses in the third web aligned with the inlets, and wherein (f) isfurther practiced by insuring that the inlets enter the openings orrecesses in the third web.
 22. A method as recited in claim 21 furthercomprising (h) imaging variable indicia on the top face after (e); (i)sensing the RFID inlets prior to formation of the composite web so as toestablish a registration signal for what will become each label; (j)making a final RFID chip read verification after (e).
 23. A method ofmaking RFID labels, comprising: (a) providing a plurality of RFIDinlets, each including a chip, on a first web; (b) covering the RFIDinlets with a second web; (c) laminating a third web onto the second webby passing the webs between laminating rolls to sandwich the inletsbetween the second and third webs without harming the inlets, to providea composite web; (d) providing pressure sensitive adhesive on a portionof one of the webs that will be an exterior portion of a label onceultimately formed; and (e) acting on the composite web so as to providethe composite web into labels having a top face, and a bottom face withpressure sensitive adhesive.
 24. A method as recited in claim 23 wherein(c) is practiced without harming the inlets by providing a recess in atleast one of the laminating rolls in alignment with the inlets.
 25. Amethod as recited in claim 23 wherein (c) is practiced by providing adeformable covering on at least one of the laminating rolls so that thedeformable covering deforms when contacting the inlets.
 26. A method asrecited in claim 23 wherein (e) is practiced by die cutting the labelsfrom one of the webs to provide a plurality of labels and matrixmaterial on a liner, and removing the matrix material from the labels onthe liner.
 27. A method as recited in claim 23 further comprisingapplying heat expandable microspheres on the chips, and heating themicrospheres to expand the microspheres to produce a cushion.
 28. Amethod as recited in claim 23 further comprising, before (b) and (c),separating a label laminate into a face web and a liner web, and thenusing one of the face web and liner web as the second web and the otheras the third web.
 29. A method as recited in claim 23 wherein (a) ispracticed by using an RFID film; and further comprising cutting the filminto individual sheets, each containing an RFID inlet, and wherein (b)and (c) are practiced to place the individual sheets onto the secondweb.
 30. A method as recited in claim 23 wherein (a)-(e) are practicedat a rate of at least about 100 ft./min.
 31. A method of making RFIDlabels, comprising: (a) providing a plurality of RFID inlets, eachincluding a chip and antenna, on a composite web; (b) providing pressuresensitive adhesive on a portion of one of the composite web that will bean exterior portion of a label once ultimately formed; (c) at least oneof verifying the functionality of, or programming, the chips prior toformation of the composite web; (d) sensing the RFID chips prior toformation of the composite web so as to establish a registration signalfor what will become each label; (e) acting on the composite web so asto provide the composite web into labels having a top face, and a bottomface with pressure sensitive adhesive; (f) imaging variable indicia onthe top face; and (g) after (e) making a final RFID chip readverification.
 32. An RFID label made according to the method of claim23.
 33. An RFID label made according to the method of claim
 13. 34. AnRFID label made according to the method of claim
 14. 35. An RFID labelmade according to the method of claim 17.